EDUCAÇÃO

 

Lista de treinamentos oferecidos pela Prevent PCB

A Preventlab organiza workshops adaptados a diferentes assuntos, tais como laminados, acabamentos, fabricação de PCB, processos de montagem, pastas e fluxos de solda, cursos do IPC e análises de falhas.

Ao participar desses eventos, os participantes têm a oportunidade de compartilhar suas experiências e aumentar seus conhecimentos.

  • IPC A 610, IPC A 600, IPC 6012, IPC 7721, IPC 7711, IPC A 620 teached by Istituto Italiano Saldatura (IIS)
  • PCB manufacturing: double sided up to multilayer HDI
  • PCB manufacturing: double sided up to multilayer HDI
  • PCB manufacturing: chemical and galvanic processes
  • PCB base materials: main characteristics
  • PCB laminates: the proper choice
  • PCB Conductive Anodic Filament (CAF) failure
  • PCB Copper foil and plating: IPC A600 -6012 requirements and lab analyses
  • PCB finishes: advantages and disadvantage
  • PCB ENIG finished: black pad phenomenon
  • PCB HAL finished: wettablility issues
  • PCB vias coverage
  • PCB panel arrays
  • PCB manufacturing defects: lab analyses
  • PCB storage and handling
  • PCB solder mask adhesion
  • PCB ENIG adhesion
  • PCB wetting test methods
  • PCB bow and twist
  • Introduction to PCB soldering methods
  • PTH soldering process
  • SMT soldering process
  • Solder alloys and fluxes: the proper choice
  • Voids phenomenon in solder joints
  • Conformal coating: typologies and characteristics
  • Cleanliness: Total Ionic Contamination and Ion Chromatography
  • Strain Gage test
  • PCBA reliability
  • PCBA MTBF
  • HR-T and chemical contaminants failures
  • Case history: ENIG finish vs SAC305/307 solder pastes
  • Case history: HAL finish vs SAC305/307 solder pastes
  • Case history: HAL finish vs SAC305/0807 solder pastes
  • Case history: SAC305 solder paste vs ENIG -Imm Ag – OSP finish
  • Case history: solder joints grain structure effects