Products

Performance PCB production

The best choices for the safety of your PCBs.

A suitable production line

We know the capability and efficiency of our production partners. Each one is selected used following a dynamic vendor rate, ensuring you the best performance only.

CO-Design & materials

We pay attention to the DFM of your new projects and analyze the layout structure to prevent criticism before production. We homologate base materials in our lab to measure their main features (Tg,CTE,TD,WA…) before producing PCBs.

IPC Class III plating

We apply IPC class III hole plating process. This is the best solution to increase PCBs reliability and reduce any risk during soldering processes and field application.

WIP

We constantly check the progress of your orders daily, using a property system. You too can follow the order placed by using our online reserved platform.

Incoming

We thoroughly check all incoming production batches before shipment. Our employees are located in the main production factories to supervise each processes steps. In our Shenzhen lab we extensively analyze a sample of each batch produced, following a dedicated inspection flow.

Logistic flexibility

We are open to satisfy all your needs regarding incoterms conditions, delivery terms, warehouse stock.

We can do anything you instruct us to do and MOST importantly we do it well.

Capability

Right experience to match PCB technology and volume to the suitable production line.
Single and Double Sides

Single and Double Sides

Material used
FR4 – FR4 Tg Low, Mid, High – CTI 175-249 PLC = 3) – TEFLON, FR4 low Er (for RF), FR4 ceramics
Laminates Halogen Free
Thickness of base PCB (including copper when> 0.8mm)
Standard 1,6 mm – To request from 0,5 to 5 mm
Panel Max. Dimension
1200 mm
Thickness of base copper
Standard (18um, 35um, 70um), Advanced (9um, 12um, 105um, 140um, 170um, 210um)
Surface Finishes
Passivated Copper OSP – Hot Air Levelling Lead Free or Sn/Pb
Immersion Silver – Immersion Tin
Hole Copper Plating
25um (average) – 20um (min. point)
NO X OUT

Multilayer

Multilayer

Material used
FR4 – Laminates HTC (High Thermal Conductivity) – Teflon – FR4 ceramics
FR4 Tg Mid, High – FR4 low Er and low Lf – Laminates Halogen Free
Thickness of base PCB (including copper when> 0.8mm)
Standard 1,6 mm – To request from 0,5 to 5 mm
Prepreg
To request
Thickness of base copper
Standard (18um, 35um, 70um), Advanced (9um, 12um, 105um, 140um, 170um, 210um)
Drilling
Mechanics (minimum drill d=0,20mm), mechanical controlled height
Laser via (max Ø laser via 0,1mmm – aspect ratio 1:1), blind and buried, for lay up sequential (HDI)
Surface Finishes
Passivated Copper OSP – HAL Lead Free or Sn/Pb – Electrolytic gold
Immersion Gold (ENIG) – Silver or Immersion Tin
Max. number of layer: 24
NO X OUT

Flex e Rigidflex

Flex e Rigidflex

Materiali utilizzabili
Polymide (e/o Kapton) – FR4 Tg Mid, High – FR4 a bassa Er – Laminati Halogen Free (only Rigid version)
Basic flex thickness
0.1mm min
Thickness of base copper
9um, 12um, 18um, 35um, 70um
Surface Finishes
Passivated Copper – ENIG
Hole Copper Plating:
25um (average) – 20um (min. point) – Rigid
12um (average) – 10um (min. point) – Flex)
NO X OUT

Aluminum PCB

Aluminum PCB

Material used
IMS (Insulated Metallic Substrate)
Manufacturer
Ventec – Deja – CSEM – ZHNM
PCB Type
Single Layer – Dual layer
Metal Thickness
0,6 – 1,0 – 1,5 – 2,0 – 3,0 mm
Insulation Thickness
50um – 75um – 100um – 125um – 150um
Temperature Coefficient
0,8 – 1,0 – 1,2 – 1,4 – 2,0 – 3,0 – 4,0 W/m°K
Base copper thickness
18um – 35um – 70um – 105um – 140um – 170um – 210um
Surface Finishes
Passivated Copper – ENIG – HAL Lead Free o Sn/Pb
NO X OUT

High dissipation PCB

High dissipation PCB

Material used
CEM3 e FR4 HTC (High Thermal Conductivity)
Produttori materiale di base
Panasonic – Nanya – Isola – Shengi
PCB Type
Single Layer – Double Layer – Multilayer
Temperature Coefficient
0,8 – 1,0 – 1,5 W/m°K
Thickness of base copper
18um – 35um – 70um (only FR4)
Surface Finishes
Passivated Copper – Hot Air Levelling Lead Free or Sn/Pb – ENIG – Electrolytic gold – Immersion Silver – Chemical Tin
NO X OUT

400
Active Clients
17'000
Sent Items
2'100'000
Pieces
3'000
New items / year

Quality Performances

We have the ambitious target of zero defects and on time delivery.

We apply acceptance requirements according to with IPC standards. Our quality control team registers defective items and deliveries statistics weekly, applying the production lines vendor rate.

Success rate 2016 98,9%